I did a review and teardown of a Miniware MHP30 SMD rework hot plate, in this blog post let’s take a look at some of the teardown pictures.
The pictures below are the top and bottom side of the main PCB. The main microcontroller used is a GD32F103TBU6 which is an ARM Cortex-M3 MCU.
This is the interface board (top and bottom side) between the main PCB and the heating element.
Here is a picture of the top section with the integrated heating element.
Here are a couple of pictures showing the middle section (left) and the bottom half of the case.