I did a review and teardown of a Miniware MHP30 SMD rework hot plate, in this blog post let’s take a look at some of the teardown pictures.
![](http://www.kerrywong.com/blog/wp-content/uploads/2023/10/box1-1024x576.jpg)
The pictures below are the top and bottom side of the main PCB. The main microcontroller used is a GD32F103TBU6 which is an ARM Cortex-M3 MCU.
![](http://www.kerrywong.com/blog/wp-content/uploads/2023/10/circuitboard2-1024x684.jpg)
![](http://www.kerrywong.com/blog/wp-content/uploads/2023/10/circuitboard1-1024x684.jpg)
This is the interface board (top and bottom side) between the main PCB and the heating element.
![](http://www.kerrywong.com/blog/wp-content/uploads/2023/10/circuitboard3-1024x684.jpg)
![](http://www.kerrywong.com/blog/wp-content/uploads/2023/10/circuitboard4-1024x684.jpg)
Here is a picture of the top section with the integrated heating element.
![](http://www.kerrywong.com/blog/wp-content/uploads/2023/10/heatingelement-1024x684.jpg)
Here are a couple of pictures showing the middle section (left) and the bottom half of the case.
![](http://www.kerrywong.com/blog/wp-content/uploads/2023/10/middlesection-1024x684.jpg)
![](http://www.kerrywong.com/blog/wp-content/uploads/2023/10/bottomsection-1024x684.jpg)