Posts tagged ‘Soldering’

Hand Soldering Fine Pitch LGA Chip

Many of the modern chips such as MEMS accelerometers and gyroscopes only come in surface mount versions and many of them come in fine pitch LGA or QFN packaging. This has created a significant challenge for people who just wanted to experiment with these components. The standard soldering technique for LGA/QFN chips is reflow soldering which requires special equipment such as reflow oven and hot air rework station. Special surface mount prototyping PCBs are also needed and these PCBs, depending on the size and complexity can be quite expensive and sometimes are pricier than the components themselves. Continue reading ‘Hand Soldering Fine Pitch LGA Chip’ »