Posts tagged ‘Gyroscope’

Teardown of a Piezoelectric Vibrating Gyroscope

Gyroscopes nowadays are based on micro-electro-mechanical systems (MEMS) technology. They are low cost and extremely miniaturized. A device combing both a three-axis gyroscope and a three-axis accelerometers (sometimes these devices are referred to as 6DOF devices) such as the MPU-6500 for example can be had in a QFN package as small as 3 mm x 3 mm and under 1 mm in height. Before these MEMS devices gained mainstream popularity however, larger piezoelectric vibrating gyroscopes were used in many consumer electronics devices.

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Hand Soldering Fine Pitch LGA Chip

Many of the modern chips such as MEMS accelerometers and gyroscopes only come in surface mount versions and many of them come in fine pitch LGA or QFN packaging. This has created a significant challenge for people who just wanted to experiment with these components. The standard soldering technique for LGA/QFN chips is reflow soldering which requires special equipment such as reflow oven and hot air rework station. Special surface mount prototyping PCBs are also needed and these PCBs, depending on the size and complexity can be quite expensive and sometimes are pricier than the components themselves. Continue reading ‘Hand Soldering Fine Pitch LGA Chip’ »